漆乐俊，宋亮，陈建升
(ABB中国研究院，北京100015)
关键词：环氧树脂,复合材料， 无机填料，高导热
中图分类号：TB322 文献标识码：A
摘要：本文研究了亚微米球形石英粉和微米高纯氧化铝粉对已含硅微粉高填充环氧树脂基复合材料导热性能和介电性能的影响。结果表明由于分散性不好,亚微米球形石英粉的添加导致复合材料性能下降。氧化铝粉的添加可以显著提高体系的导热系数和介电常数，对介电损耗影响很小。在相同条件下,双峰分布的氧化铝粉较单峰分布提高导热系数的效果更明显，添加30 wt%双峰分布氧化铝粉和50 wt%硅微粉样品的导热系数达到了1.72 W/m·K。
Study on preparationand properties of the highly-filled and high thermal-conductive epoxycomposites
QI Lejun, SONG Liang, Chen Jiansheng
(ABBCorporate Research China, Beijing 100015, China)
Keywords: Epoxy；Composite；Inorganicfillers； High thermalconductivity
Abstract: The impact ofsub-micron spherical silica and micron alumina fillers on the thermal conductivityand dielectric properties of highly filled epoxy composites were investigated .The results show that the addition of sub-micron silica fillers decreased thecomposite properties due to the poor dispersion of those fillers in epoxymatrix. The addition of alumina fillers significantly increased the thermalconductivity and dielectric constant of the epoxy composites, while had noobvious influence on the dielectric loss. Under the same conditions, The bi-modaldistributed alumina had higher thermal conductivity than the single-modalalumina fillers. The thermal conductivity of samples with 30 % bi-modal aluminaand 50 % silica flour reached 1.72 W/m·K.